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PRODUCT > DYNAFORM > INC solver
CapabilitiesDFE Module(supports die face design)- Gravitiy Load Simulation- Binder Wrap Simulation- Crash Form Forming Simulation- Single Action Foriming Simulation- Double Action Foriming Simulation- Springback Prediction- Lancing Application FeaturesÃÖ±Ù multiple-core computing platform »ç¿ëÇϸé, DIE face engineeringÀÏÀ» ºü¸¥ ¼Óµµ·Î Áö¿øMesh¸¦ ¼öÁ¤ÇÏ´Â µ¿¾È CAD surface°¡ ÇÊ¿ä ¾øÀÌ ÃæºÐÈ÷ Áö¿øMesh Adaptivity¸¦ Á¶ÀýÇϱâ À§ÇØ µ¿½Ã ºÐÇÒ-°áÇÕ Á¢±ÙÀ» »ç¿ëSimulation setupÀº ºü¸£°í È¿°úÀûÀÌÁö¸¸, ÃÖ»óÀÇ °á°ú¸¦ À§Çؼ ¹Ì¼¼Á¶Á¤ parameter°¡ ´õ È®½ÇDIE face engineering ¸ñÀûÀ» À§ÇØ ÃÖ¼ÒÀÇ Æ®·¹ÀÌ´×°ú ±â¼úÀû Áö¿øÀÌ ¿ä±¸
°æ±âµµ °í¾ç½Ã ÀÏ»ê µ¿±¸ ÀåÇ×µ¿ 760¹øÁö ³²Á¤½ÃƼÇÁ¶óÀÚ1Â÷ 804È£ · ´ëÇ¥ÀÚ : ÀÌÇüÁÖ · »ç¾÷ÀÚ¹øÈ£ : 116-81-63895· ´ëÇ¥¾È³»ÀüÈ : 031-903-2061 · FAX : 031-903-2076 · E-mail : kostech@kostech.co.kr
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